SMARC
CiPC-X7000RE
3.5" SBC Industrial Compact Embedded Core Computer Module
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- Specifications
- Features List
- Applications / Use Cases
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CiPC-X7000RE
Specifications
Features List
Intel® Amston Lake Core：Leverages low-power Intel® Gracemont microarchitecture, delivering advanced compute and localized AI inference capabilities within an ultra-efficient 6 ~ 15W TDP footprint.
SMARC 2.1.1 Standardization：Complies with the global SMARC module form factor, allowing engineers to easily swap and upgrade core processors without redesigning the carrier board layout.
LPDDR5 Blazing-Fast Memory：Outfitted with high-speed onboard LPDDR5 memory and eMMC 5.1 storage array, ensuring rapid boot sequences and reliable storage caching in vibration-prone environments.
Triple Independent Displays：Integrates high-performance Intel® UHD Graphics, natively driving up to three independent high-definition visual lines via HDMI, DisplayPort, or eDP/LVDS.
Industrial High-Bandwidth I/O：Features flexible expansion paths including PCIe Gen3 lanes, multiple USB 3.2 ports, Dual Gigabit Ethernet lines, and native serial buses (CAN, I2C, SPI, UART).
Wide-Temperature Resilience：Engineered to function flawlessly under extreme industrial floor conditions across a demanding -40 ~ 85C thermal operating range.
Applications / Use Cases
Industrial IoT Gateways & Aggregators：Gathers, filters, and pushes dense machine telemetry from factory floors to the enterprise cloud with robust edge-side encryption.
Automated Factory HMIs & Terminals：Powers complex touchscreen control panels and production line interfaces requiring high-definition graphics and 24/7 reliability.
Smart Retail Kiosks & Vending Systems：Handles interactive customer-facing digital graphics, inventory tracking, and localized payment processing routines smoothly.
Medical Equipment Diagnostics：Integrated into laboratory instruments, patient monitors, or bedside diagnostic arrays requiring quiet operation and a compact footprint.
